Our research focuses on the techniques for monitoring the current density distribution of the real-time electroplating. In the previous research, a novel technique to estimate electroplating current densities on plated surfaces from the data of the electric potentials in the plating cells has been developed for LSI fabrication technology. The technique described in this paper has been applied for a 2 dimensional (2D) analysis in our previous research work; however, the 2D approach limits the application of the proposed method. In this research, we applied the monitoring technique with 3 dimensional (3D) analysis. Although the inverse analysis using the 3D analysis tends to be large scale, it is important for the practical usage to monitor current density on target region accurately and efficiently. Therefore we have developed an efficient inverse analysis technique for monitoring of electroplating current density on the target region and verified the effectiveness of the proposed technique by using numerical simulations.